Relationship between current, drift velocity and thermal velocity

[yanyin]

for a normal solid cylindrical resistor, made of say copper, at room temperature, describe the relationshop between the current in the conductor, the drift velocity of conduction electrons in the conductor, and the thermal velocity of conduction electrons in the conductor.

 

[Bonfield]

The drift velocity and current are proportional. The thermal speed depends on the temperature. Current is not much affected.

 

[yang09]

could u give a formula pls

 

[johng23]

The thermal energy is 3/2 kT, so equating that to kinetic energy, thermal velocity is sqrt(3kT/m), on the order of 10^5 m/s at room temperature.

The drift velocity is related to current like I = vnqA, where n is the concentration (per volume), of electrons, q is the charge. In terms of current density, J = vnq. Current density is charge per second per area, so dividing both sides by q relates a particle flux on the left hand side to a concentration times a velocity on the right. This is a general relationship in kinetics.

 

[sardar]

The relationship between current, drift velocity, and thermal velocity in a normal solid cylindrical resistor made of copper at room temperature is complex and dependent on various factors. The current in the conductor is directly proportional to the drift velocity of conduction electrons. This means that as the current increases, the drift velocity of conduction electrons also increases.

The drift velocity of conduction electrons is the average velocity at which the electrons move in the direction of the electric field. In a solid conductor, the electrons are constantly colliding with the atoms of the material, which causes them to change direction and slow down. This results in a lower drift velocity compared to the thermal velocity of the electrons.

On the other hand, the thermal velocity of conduction electrons is the average velocity at which the electrons move due to their thermal energy. At room temperature, the thermal velocity of electrons in copper is on the order of 10^5 m/s, which is much higher than the drift velocity.

The relationship between the thermal velocity and the drift velocity can be described by the concept of mean free path. The mean free path is the average distance an electron travels before colliding with an atom. In a normal solid conductor, the mean free path is much shorter than the length of the conductor. This means that the electrons are constantly colliding and changing direction, resulting in a lower drift velocity.

Furthermore, the thermal velocity of electrons in a conductor also depends on the temperature of the material. As the temperature increases, the thermal velocity also increases, leading to an increase in the mean free path. This results in a decrease in the number of collisions and an increase in the drift velocity.

In summary, the relationship between current, drift velocity, and thermal velocity in a normal solid cylindrical resistor made of copper at room temperature is complex and dependent on factors such as temperature, mean free path, and the material properties. However, it can be generally stated that an increase in current leads to an increase in drift velocity, while an increase in temperature leads to an increase in both thermal velocity and drift velocity.