- #1
sgsawant
- 30
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Electroplated a 5 micron layer of copper a few days ago. Was wondering why there's sulphuric acid in the solution.
Sulphuric acid is added to the copper sulfate solution to increase the conductivity of the solution. This allows for a more efficient flow of electricity during the electroplating process.
Yes, other acids such as hydrochloric acid or nitric acid can be used for electroplating with copper sulfate. However, sulphuric acid is commonly used due to its availability and effectiveness in increasing the conductivity of the solution.
Yes, the concentration of sulphuric acid can affect the electroplating process. A higher concentration of sulphuric acid will result in a more conductive solution and a faster electroplating process. However, too high of a concentration can also cause the plating to be uneven or have a rough surface.
Sulphuric acid is typically added to the copper sulfate solution before the copper anode is placed in the solution. This allows for the acid to mix evenly with the solution and increase its conductivity.
The purpose of electroplating with copper sulfate and sulphuric acid is to coat a metal object with a thin layer of copper. This process can improve the appearance, durability, and conductivity of the object, as well as protect it from corrosion.