Boron Diffusion in n-type Silicon: Impurity Concentration & Time

  • Thread starter kidia
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Your Name]In summary, to calculate the impurity concentration for a boron diffusion on a doped n-type silicon substrate with a constant surface concentration of 4.8*10^17/cm^3 and a desired junction depth of 2.8*10^-6m, we can use the equation N(x) = 4.8*10^17*exp(-x/2.8*10^-6). The time it will take to cover the junction depth can be calculated using Fick's Second Law with a diffusion coefficient of 8.54*10^-5 cm^2/s and a temperature of 1100 degrees Celsius, resulting in a time of 9.17*10^-10 seconds
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kidia
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I have a question here,
A uniform doped n-type silicon substrate of 0.1ohm-cm resistivity is to be subjected to a boron diffusion with constant surface concetration of 4.8*10^17/cm cubic.The desired junction depth is 2.8*10^-6m .Calculate the impurity concetration for the boron diffusion as a function of distance from the surface and how long will it take to cover the distance if the temperature at which this diffusion is conducted is a 1100Cetigrade
 
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Hello,

Thank you for your question. To calculate the impurity concentration for the boron diffusion as a function of distance from the surface, we can use the following equation:

N(x) = N0*exp(-x/δ)

Where N(x) is the impurity concentration at a distance x from the surface, N0 is the initial impurity concentration (4.8*10^17/cm^3 in this case), and δ is the junction depth (2.8*10^-6m in this case).

Plugging in the values, we get:

N(x) = 4.8*10^17*exp(-x/2.8*10^-6)

To calculate the time it will take to cover the desired junction depth, we can use Fick's Second Law:

δ = √(Dt)

Where δ is the junction depth, D is the diffusion coefficient, and t is the time.

We can find the diffusion coefficient using the following equation:

D = D0*exp(-Ea/kT)

Where D0 is the pre-exponential factor, Ea is the activation energy, k is the Boltzmann constant, and T is the temperature in Kelvin.

Assuming a pre-exponential factor of 10^3 cm^2/s and an activation energy of 3.5 eV, we can calculate the diffusion coefficient at 1100 degrees Celsius (1373 Kelvin):

D = 10^3*exp(-3.5/8.62*10^-5*1373) = 8.54*10^-5 cm^2/s

Now, plugging in the values for δ and D, we can solve for t:

2.8*10^-6 = √(8.54*10^-5*t)

t = (2.8*10^-6)^2/(8.54*10^-5) = 9.17*10^-10 seconds

Therefore, it will take approximately 9.17*10^-10 seconds or 0.917 nanoseconds to cover the desired junction depth at a temperature of 1100 degrees Celsius.

I hope this helps answer your question. Let me know if you have any further inquiries.
 

What is boron diffusion in n-type silicon?

Boron diffusion in n-type silicon refers to the process of incorporating boron atoms into the crystal lattice of a silicon substrate. This is typically done to create p-type regions in a silicon chip, which is crucial for the functioning of electronic devices.

How does impurity concentration affect boron diffusion in n-type silicon?

The concentration of impurities, specifically boron atoms, can significantly impact the diffusion process in n-type silicon. A higher concentration of boron atoms will lead to a faster diffusion rate, resulting in a thicker p-type region. This can also affect the overall electrical properties of the silicon substrate.

What is the role of time in boron diffusion in n-type silicon?

The time of the diffusion process is critical in determining the thickness and depth of the p-type region. The longer the diffusion process, the deeper the boron atoms will penetrate into the silicon substrate, resulting in a thicker p-type layer. However, the diffusion rate is not linear and decreases with time, eventually reaching equilibrium.

What factors can affect the diffusion rate of boron in n-type silicon?

The diffusion rate of boron in n-type silicon can be affected by various factors, including temperature, impurity concentration, crystal orientation, and the presence of any impurity species that can slow down or enhance the diffusion process.

How is the diffusion profile of boron in n-type silicon measured?

The diffusion profile of boron in n-type silicon can be measured using techniques such as secondary ion mass spectrometry (SIMS) or sheet resistance measurements. These methods can provide information on the depth and concentration of boron atoms in the substrate, allowing for the characterization of the diffusion process.

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