What is the impact of bias on DC sputtering for thin film deposition?

In summary, the speaker is asking about the role of bias in plasma build-up during DC sputtering and whether there is a difference in film thickness with and without bias. They also ask about the impact of material and mention using XRF measurement to determine thickness. The other person explains that the film structure and application may vary depending on whether bias is applied or not, and suggests researching literature and potential advantages of biasing for the specific material and application.
  • #1
kimmylsm
19
0
Hi, I would like to know when deposition using DC sputtering, bias play a role in plasma build-up, but with bias applied and without bias applied, still obtain the same thickness of thin film layer, what actually the differences between bias and without bias during DC sputtering? Thanks.
 
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  • #2
Is the film structure the same in both cases? Did you do imaging? It depends on what material you're working with.
 
  • #3
the target source is the same in both cases, no imaging done, if it depend on what material i used, how should i know whether with bias or without bias will be appropriate?
i am using XRF measurement to obtain the thickness of layer. thanks.
 
  • #4
It depends what you are trying to do or reproduce. The same material can be bias sputtered or not, and each way may have its application. If you have no reason to bias, then don't complicate things for no purpose. Find litterature on your matarial and application, and see whether there is an advantage to biasing in your case. Google "bias substrate sputtering" for sample papers.
 

1. What is the difference between bias and non-bias sputtering?

Bias sputtering involves applying an electric field to the target material during the sputtering process, while non-bias sputtering does not use an electric field. This results in different sputtering rates and can affect the properties of the deposited film.

2. How does bias sputtering affect the properties of the deposited film?

Bias sputtering can improve the adhesion, density, and crystallinity of the deposited film. It can also reduce the surface roughness and increase the film thickness. However, it can also introduce impurities or cause changes in the chemical composition of the film.

3. Can non-bias sputtering be used for all materials?

Non-bias sputtering can be used for most materials, but it may not be suitable for highly insulating or low melting point materials. These materials may require the use of bias sputtering to achieve a stable sputtering process.

4. What are the advantages of using bias sputtering?

Bias sputtering can provide better control over the sputtering process, resulting in more uniform and precise deposition. It can also improve the film properties and adhesion, especially for materials that are difficult to sputter without an electric field.

5. Are there any potential drawbacks to using bias sputtering?

One potential drawback of bias sputtering is the introduction of impurities or changes in the film composition, as mentioned earlier. It can also increase the complexity and cost of the sputtering process. Additionally, if not properly controlled, bias sputtering can lead to over-sputtering and damage to the target material.

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