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jegues
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Homework Statement
Typical semiconductor fabrication technologies employ copper (ρ ~ 15.7nΩm; μr ~1) as the interconnect material. A process is designed for a clock frequency of 1GHz, has interconnect cross sections ranging between 35nm x 70nm and 0.18um and 90nm. Quantitatively determine whether it is reasonable to expect a uniform current density across these wire cross-sections
Homework Equations
The Attempt at a Solution
I know that,
[tex]\vec{J} = \sigma \vec{E}[/tex]
and that,
[tex]J = \frac{I}{A}[/tex]
I'm not sure how to obtain J though.
With the information given, I can calculate the skin depth,
[itex]\delta = \sqrt{\frac{2}{\omega \sigma \mu}} \approx 2\mu m[/itex]
but I don't know how they helps me determine whether the current density will be uniform across these two wire sections.
The area of these sections can easily be calculated by multiplying the two dimensions.
Any ideas?