We now electrons do tunnel and for example FE happens because of this.
However, is it true to scale up this effect for non-subatomic particles? For example, is it OK to say, if you are behind a wall and hit yourself to the wall, there is a chance that you might Tunnel and see yourself on...
I want to solve this integral without using series expansion. The answer should be in a closed form. I wonder if this is possible?
The Attempt at a Solution
I used numerical methods and was able to solve it numerically for a given...
Suppose there are two plasma cases, conditions are the same, except for the gases present:
Since the dissociation energy of nitrogen is higher than oxygen, what could be concluded from it? Could it be more energetic nitrogen ions than oxygen ions (because initially...
I wonder if there's any difference between the "impedance matching" and "maximum power transfer" criterion?
I assume in both cases, one impedance should be designed to be the complex conjugate of the other.
This seems to be a very simple (stupid) question:
If an inert gas is purged inside a distilled water container, bubbles are formed on the surface. The question is what are the constituents of those bubbles? and those constituents seems to be formed during a physical process, not a chemical...
I was thinking about measuring the temperature of an arc discharge. The size of the discharge is very small, in the order of micrometer. So it is not possible to put a thermocouple near the it.
Thank you very much.
I have deposited about 200nm of Au and I am going to deposit another 200nm layer of Au on top of this layer. All deposition are with e-beam evaporation and are done in vacuum. I have two questions:
1- Do you know how the cohesion between these two layers is?
2- I am going to deposit the...
I have a 200nm Au seed layer. and I am electroplating Cu on that using a solution. but the result is not good. The adhesion between the electroplated copper and gold seed layer is very poor and it easily peels off.
1-I wonder how can I increase the adhesion between them?
I want to make a chamber as O2-free. The chamber is not perfectly sealed, so it has some small holes. I have used N2 gas (by pumping N2 from one input and escaping of O2 from holes in junctions). Now, I want to measure the amount of remaining O2 inside chamber. How can I do that? Is...
I have two layers: 1-2nm of Fe on top of 10-30 nm of Al. I am going to etch some portions of the top Fe layer.
So I am looking for an etchant that attacks Fe and not Al.
Can you help me?
I am going to design a cantilever switch which is working with electrostatic (capacitive) force.
I want to design that. That is to find the dimension and material of that.
I was wondering if you could kindly suggest a reference for designing this.
Thank you very much.