A few questions about electrodeposition of Cu with H202 and CH₃COOH

[theycallmevirgo]

TL;DR

Is the byproduct safe to pour down the drain? Can the current draw (for a given voltage) be calculated to any degree of accuracy?

I would like to use this process to plate copper on to a surface treated with conductive paint. These Chemistry SE questions discuss an etching process with similar reagents - 1,2,3

A) The first SE question discusses safe disposal of byproducts, but even if there is a conclusive answer (and I'm missing it if there is), does it apply to the electrodeposition reaction? Is it safe to pour the byproduct down the drain?

B) Assume surface area under 50 cm^2 and a 6V supply. Will current draw ever exceed 5A? Is it possible to calculate current draw for given voltage per cm^2? What deviation should I reasonably expect from calculated value before I decide that my setup is wrong?

C) I want to save some time and buy this instead of chopping up scrubbing pads as the instructions suggest. Can I calculate to any accuracy amount of copper consumed per cm^2 of plated surface? Is it simply a matter of molar conversion from plating thickness? If so, how thick is the layer?

Many thanks in advance

Joe

 

[berkeman]

Is the byproduct safe to pour down the drain?

Contact your local Household Hazardous Waste department with this question please.

Thread is locked temporarily for Mentor review...

EDIT -- Thread is reopened.

 

[Borek]

Spent solutions will contain some amount of copper which is toxic, so no, putting them own the drain doesn't sound OK.

Calculating current is in theory possible, in practice it is easier to estimate the surface, calculate the current required (most electrochemical processes have an optimal current density) and use a regulated current source.

Layer thickness in electrodeposition is whatever you want it to be, it is directly proportional to the charge (or, which makes it even easier to control, to the electrodeposition time in a constant current operation).