Alternative methods to reach given level of vacuum

  • Thread starter Jack1991
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In summary, in order to meet the requirements for the bakeout test at system level, a vacuum level of 10E-5 mbar is necessary and alternative methods, such as a nitrogen purge, may not be comparable. Other methods, such as using a getter material or a higher vacuum capability oven, may also be considered to reduce outgassing.
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Jack1991
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I am currently collaborating in a student team to develop a CubeSat. One of the requirements provided by our launch contractor is to perform a bakeout test at system level. The given requirements for that tests are a duration of 24 hours, at a temperature of 50 degrees Celcius at a vacuum level of 10E-5 mbar.

Currently we are equipped with a thermal vacuum oven that can reach a vacuum level of 1 mbar. Therefore we are investigating alternative methods to reach the given requirements (if that is possible). One of the possibilities we thought of was to perform the test at 1 mbar and subsequently use nitrogen to purge the outgassed particles. I wonder whether this method is comparable to having a vacuum level of 10E-5 mbar without a final purge?

Else, are there any alternative methods to reach the same outgassing effects without going the given state of vacuum?

Thanks for your help!
 
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Unfortunately, a nitrogen purge cannot be used to achieve the same outgassing effects as a vacuum level of 10E-5 mbar. A vacuum environment provides a much more effective means of removing outgassed particles from the CubeSat system. Other methods that may be effective at reducing outgassing include using a getter material (e.g. activated carbon) to absorb the outgassed particles, or using a bake-out oven with a higher vacuum capability (such as 10E-7 mbar).
 

FAQ: Alternative methods to reach given level of vacuum

1. What are alternative methods to reach a desired level of vacuum?

There are several alternative methods to achieve a specific level of vacuum, including cryogenics, sputtering, and chemical etching. Cryogenics involves cooling a gas to extremely low temperatures, while sputtering involves bombarding a sample with ions to create a vacuum. Chemical etching involves using chemical reactions to remove gas molecules from a vacuum chamber.

2. How do alternative methods compare to traditional methods of vacuum creation?

Alternative methods may be more efficient and cost-effective compared to traditional methods such as mechanical pumps or turbo pumps. They also have the potential to reach lower levels of vacuum.

3. Are there any limitations to using alternative methods for vacuum creation?

Some alternative methods may have limitations in terms of the level of vacuum that can be achieved. They may also require specialized equipment and expertise.

4. Can alternative methods be combined with traditional methods for more effective vacuum creation?

Yes, it is possible to combine different methods to reach a desired level of vacuum. For example, cryogenic cooling can be used in conjunction with mechanical pumps to achieve lower levels of vacuum.

5. How do I determine which alternative method is best for my specific needs?

The best method for creating a vacuum will depend on factors such as the required level of vacuum, the type of gas being removed, and the available equipment and resources. It is important to consult with experts and conduct thorough research to determine the most suitable method for your specific needs.

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