Hi all: I have a 200nm Au seed layer. and I am electroplating Cu on that using a solution. but the result is not good. The adhesion between the electroplated copper and gold seed layer is very poor and it easily peels off. 1-I wonder how can I increase the adhesion between them? 2-Does depositing (e-beam evaporation) a layer of Cu on top of the Au seed layer before plating help? Thank you very much.