Dismiss Notice
Join Physics Forums Today!
The friendliest, high quality science and math community on the planet! Everyone who loves science is here!

Electroplate Cu on gold

  1. Jun 23, 2010 #1
    Hi all:

    I have a 200nm Au seed layer. and I am electroplating Cu on that using a solution. but the result is not good. The adhesion between the electroplated copper and gold seed layer is very poor and it easily peels off.
    1-I wonder how can I increase the adhesion between them?

    2-Does depositing (e-beam evaporation) a layer of Cu on top of the Au seed layer before plating help?

    Thank you very much.
  2. jcsd
  3. Jun 24, 2010 #2
    Last edited by a moderator: Apr 25, 2017
  4. Jun 25, 2010 #3
    Thank you MLSmateo.
    Actually, I found the problem. The Cu-plating quality on Au is good. I made a mistake.
    Yes, I have read somewhere that this process is verified, but the reverse process (EP Au on Cu) is very hard to realize.
    Thanks again anyways.
Share this great discussion with others via Reddit, Google+, Twitter, or Facebook