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Electroplate Cu on gold

  1. Jun 23, 2010 #1
    Hi all:

    I have a 200nm Au seed layer. and I am electroplating Cu on that using a solution. but the result is not good. The adhesion between the electroplated copper and gold seed layer is very poor and it easily peels off.
    1-I wonder how can I increase the adhesion between them?

    2-Does depositing (e-beam evaporation) a layer of Cu on top of the Au seed layer before plating help?

    Thank you very much.
     
  2. jcsd
  3. Jun 24, 2010 #2
    Last edited by a moderator: Apr 25, 2017
  4. Jun 25, 2010 #3
    Thank you MLSmateo.
    Actually, I found the problem. The Cu-plating quality on Au is good. I made a mistake.
    Yes, I have read somewhere that this process is verified, but the reverse process (EP Au on Cu) is very hard to realize.
    Thanks again anyways.
     
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