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Atomic and Condensed Matter
Flexibility and chemical bonding
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[QUOTE="Mapes, post: 5606969, member: 109737"] "Flexibility" is ambiguous because it might mean how much force (if you're pushing down on a cantilever) or torque (if you're applying a bending moment) is required to obtain a certain deflection. We quantify this value by the stiffness or elastic modulus (e.g., the Young's elastic modulus). Alternatively, "flexibility" might mean the strength of a film, i.e., how much bending stress it can accommodate before it fails. Very generally, for ceramics and metals, both stiffness and ideal strength scale with bonding strength. So does melting temperature, so a more refractory compound is usually also stiffer. A complication, however, is that the strength can be much lower than expected in brittle materials, including the material examples you give, when surface imperfections exist. The stiffness of a material is near-universal; the strength depends much more on the deposition method and surface morphology. A look at the literature suggests that Si and IGZO have similar Young's moduli, between 100 and 200 GPa. Another factor is that if a thinner layer of material A can do the same job as a thicker layer of material B, the first device can be made more flexible (because the bending stress scales with the distance from the neutral axis) for reasons that aren't even connected to material properties. [/QUOTE]
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