How does the dry process work using porous silicon?

In summary, The conversation discusses the use of porous silicon in the wet and dry methods for thermal oxidation. The wet method involves using electrochemical processes to allow water molecules to diffuse into the porous silicon, while the dry method remains unclear in the literature and requires further understanding of how it works. Both methods aim to prevent collapse of the cavity structure. See attachments 01 and 02 for visual examples.
  • #1
LUFER
4
0
I'm having trouble finding in the literature specifically about the porous silicon process using the dry method instead of the more common wet method that is used.
wet process
Using porous silicon to promote wet thermal oxidation uses the process electrochemically will allow water molecules to diffuse into it. Wet oxide is often used for oxide growth. So that the structure (cavities) does not collapse after using the previously mentioned process or remove that PENTAN.
Example: See the photo in attachment 01

dry process
If it refers to the dry process, I can't find anything profound in the literature, it just cites the case. I would need to understand how this process works, the little I understood is that it uses two flasks where there is a cylindrical flask where there is an inlet and an outlet and the other flask where the Porous Silicon is used. If anyone can help me where I can find the literature.

Example: See the photo in attachment 02
 

Attachments

  • 01.png
    01.png
    18.6 KB · Views: 118
  • 02.png
    02.png
    3.2 KB · Views: 104

FAQ: How does the dry process work using porous silicon?

What is the dry process in the context of porous silicon?

The dry process refers to a method of fabricating porous silicon using techniques that do not involve liquid solutions. This typically includes dry etching or plasma etching, where silicon wafers are exposed to reactive gases that selectively remove material, creating a porous structure. This process allows for precise control over the porosity and thickness of the silicon layer.

How does the dry process create porosity in silicon?

In the dry process, the introduction of reactive gases, such as fluorine or chlorine-based gases, leads to the selective etching of silicon. The etching can be controlled to create voids and pores within the silicon matrix. By adjusting parameters like gas composition, pressure, and power, the size and distribution of the pores can be tailored for specific applications.

What are the advantages of using the dry process for porous silicon fabrication?

The dry process offers several advantages, including higher precision in etching, better control over pore size and distribution, and the ability to create complex geometries. Additionally, it minimizes contamination risks associated with liquid chemicals and can be integrated into existing semiconductor fabrication processes, making it more efficient for industrial applications.

What applications benefit from porous silicon created by the dry process?

Porous silicon produced through the dry process has a wide range of applications, including in photonic devices, sensors, drug delivery systems, and energy storage materials. Its unique properties, such as increased surface area and tunable optical characteristics, make it particularly useful in these fields.

Are there any limitations to the dry process for creating porous silicon?

While the dry process has many advantages, it also has limitations. These include potential challenges in achieving uniform porosity across large areas and the complexity of process optimization. Additionally, the equipment required for dry etching can be expensive and may require specialized knowledge to operate effectively.

Back
Top