Today I have soldered my first 0603 metric smd device to wires under the microscope. This is extremely tedious. 0.04 mm dia wire is readily available, and I know for devices like magnetic heads in hard disks, these things are being done commercially. How do they do it? How do they solder and glue on this size? I couldn't really find anything on the web. The sharpest soldering irons are still .1 mm wide, solder wire is almost always thicker than .5 mm. Laser soldering also seems thicker. Are there micromanipulators with integrated soldering irons? How can you deposit drops of glue with .1 mm width or deliver tiny amounts of tin? Are there capillaries thinner than say .2 mm outside (syringes are thicker) The only thing coming close to what I need is wire bonding, but it's not very compatible with most surfaces and materials. It all burns down to: Can I buy this somewhere, or is it all custom build to fit the job? How do others do it, can you point me to papers?