To fixate some tiny wires for reflow soldering I need a glue that will withstand 250°C or 350°C and can be removed later. It should also not "sweat" or dissolve in tin so the solder stays clean. I have thought about gypsum (plaster) and I hope it's removable with acid. But I fear it will get crumbly, isn't sticky enough and not nice to use. Do you have any suggestions? I am sure there must be something water based. If salt would only be more sticky, and sugar wouldn't burn... Being common in chemistry labs would be a plus, but not a prerequisite.