Oxidation in Processor Making: Purpose & Repeating?

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In summary, during the process of making a processor, oxidation is used to convert silicon into silicon oxide, which is then used to create the gate insulator of MOSFET transistors. This process is ideal for creating a high-quality, thin oxide layer. However, due to the high temperatures involved, it is not typically used beyond the early steps. Other methods, such as chemical vapor deposition, are also used to deposit oxide layers. Additionally, it is important to note that lithography, not photography, is used in this process.
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What is the purpose of oxidation during the process of making processor?

Is it repeatedly perform, like photography?
 
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You may wish to take a look at this slide (from the low-resolution 'How to Make a Transistor' presentation at Applied Materials):
http://www.appliedmaterials.com/htmat/static04.html

Oxidation converts the silicon into silicon oxide (a.k.a. oxide), at very high temperatures. As this is a slow process, it's used when you don't need a thick oxide (at most a few low hundreds of nm), but do need one which is high quality (smooth, crystalline, free of voids and pinholes). Creating the gate insulator of the MOSFET transistors that comprise CMOS is what this process is ideal for.

Since it happens at very high temperatures (which might melt metal layers, or migrating things you don't want migrated, or start crystallizing things you don't want crystallized), it isn't typically used beyond the early steps.

Thermal oxidation isn't the only way to make oxide however, so you'll usually see other oxide (like the plugs that insulate adjacent transistors from one another) deposited via some CVD (chemical vapour deposition) process.

Lastly, it's lithography, not photography. Hope this helps!
 
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1. What is oxidation in processor making and why is it important?

Oxidation in processor making refers to the process of exposing the surface of a silicon wafer to oxygen or other oxidizing agents in order to create a thin layer of silicon dioxide. This layer serves as an insulator and protects the underlying components of the processor. Oxidation is an important step in the manufacturing of processors as it helps to improve the reliability and performance of the final product.

2. How does oxidation affect the electrical properties of a processor?

Oxidation plays a crucial role in determining the electrical properties of a processor. The thin layer of silicon dioxide created through oxidation acts as an insulator, preventing the flow of electricity between different components of the processor. This helps to reduce leakage and improve the overall efficiency of the processor.

3. Can oxidation be repeated multiple times during the processor making process?

Yes, oxidation can be repeated multiple times during the processor making process. This is known as repeated oxidation, and it is often used to create thicker layers of silicon dioxide for specific applications. The number of times oxidation is repeated depends on the desired thickness of the layer and the specific requirements of the processor being produced.

4. Are there any potential drawbacks to oxidation in processor making?

While oxidation is an important step in processor making, there are some potential drawbacks to consider. One drawback is that the process can introduce impurities into the silicon wafer, which can affect the performance of the processor. Additionally, repeated oxidation can also lead to an increase in defects and reduce the yield of the manufacturing process.

5. What advancements have been made in oxidation technology for processor making?

Over the years, there have been several advancements in oxidation technology for processor making. One major development is the use of rapid thermal oxidation, which allows for faster and more precise control of the oxidation process. Additionally, the introduction of low-pressure oxidation has helped to reduce impurities and improve the overall quality of the oxide layer. Other advancements include the use of alternative gases and improved equipment for better control and efficiency.

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