Coating Hollow Shapes w/ Vacuum Evap: Atom vs Ion?

In summary, the conversation discusses the possibility of using vacuum evaporation, sputtering, and ion plating processes to coat the inside walls of holes and other hollow shapes of substrates. There is a question about whether the source materials are ejected in the form of atoms or ions, and the poster has looked for answers in textbooks but has not found a confirmed answer. The use of CVD and ALD as potential solutions is also mentioned.
  • #1
kelvin490
Gold Member
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3
Is it possible to use vacuum evaporation, sputtering and ion plating processes to coat the inside walls of holes and other hollow shapes of substrates? I wonder whether the source materials are ejected in the form of atoms or ions? Many books say atom but how can they travel to the substrate if they don't have charge?

I have looked for several textbooks but cannot get a confirmed answer.
 
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  • #2
Thanks for the post! Sorry you aren't generating responses at the moment. Do you have any further information, come to any new conclusions or is it possible to reword the post?
 
  • #3
Yes, but lots of technical challenges. Most vacuum deposited coating are line of sight, but lots of ways to skin a cat.

CVD might be considered.

Your question on ions or atoms, which process type? Fundamental are available in all over the place.
 
  • #4
ALD is the best choice.
 

1. How does vacuum evaporation work?

Vacuum evaporation is a process used to deposit thin films of material onto a substrate. It involves heating a material in a vacuum chamber until it reaches its vaporization point, at which point the molecules of the material will be released and travel to the substrate, forming a thin film.

2. What is the difference between atom and ion in vacuum evaporation?

In vacuum evaporation, atoms and ions are two different types of particles that can be used to deposit a thin film. Atoms are neutral particles, while ions are charged particles. Atom deposition is a slower process, but it produces a more uniform film. Ion deposition is faster but can result in a more uneven film.

3. Why is vacuum evaporation preferred for coating hollow shapes?

Vacuum evaporation is preferred for coating hollow shapes because it allows for a more even and uniform coating on all surfaces, including the interior surfaces of the hollow shape. This is because the vacuum environment allows the particles to travel freely and evenly across all surfaces without interference.

4. What factors affect the success of vacuum evaporation for coating hollow shapes?

The success of vacuum evaporation for coating hollow shapes depends on a few factors, including the type of material being evaporated, the temperature at which it is heated, the vacuum level in the chamber, and the shape and size of the hollow object being coated. Additionally, the cleanliness of the substrate and the compatibility of the material being deposited with the substrate can also affect the success of the coating.

5. Can any material be used for vacuum evaporation?

No, not all materials can be used for vacuum evaporation. The material must have a relatively low vaporization point and be compatible with the substrate being coated. Metals and semiconductors are commonly used for vacuum evaporation, but some plastics and organic materials can also be used with specialized equipment.

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