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- when ICs undergo accelerated testing via thermal cycling, doesnt rate of temperature increase factor into the equation?

When ICs undergo accelerated testing via thermal cycling, wouldn't rate of temperature increase factor into the equation? For example, in Equation 4 in this pdf: http://www.issi.com/WW/pdf/semiconductor-reliability.pdf

The Temp Cycling Acceleration Factor is a function of Tmax,stress and Tmin,stress. Wouldn't this also be a function of the rate at which Tstress is increased? For example, if you thermal shock an IC from 0C to 100C in 1 second, it probably would have a different behavior than 0C to 100C in 1hr. Is this capture anywhere in the equation?

The Temp Cycling Acceleration Factor is a function of Tmax,stress and Tmin,stress. Wouldn't this also be a function of the rate at which Tstress is increased? For example, if you thermal shock an IC from 0C to 100C in 1 second, it probably would have a different behavior than 0C to 100C in 1hr. Is this capture anywhere in the equation?