I am trying to model intrinsic stress of some thin film heterostructures. As I am not a modeler but an experimentalist/processor by trade, I would prefer to minimize the amount of time I spend banging my head against the wall trying to find out if this software is appropriate. So, my question is whether COMSOL is appropriate for this. I note that they include thermal expansion coefficient in the materials database, but I did not see lattice parameters/crystal structures etc. If so, I also need to know if it is possible to include model amorphous materials? I suppose if not I can manually alter some of the parameters slightly to force the model to agree with the raman stress measurements.