Recent content by DePurpereWolf

I'm trying to derive the resonance frequencies for a simple fixed-fixed beam, as opposed to a simply-supported beam. I'm working off the following references: 1. http://emweb.unl.edu/Mechanics-Pages/Scott-Whitney/325hweb/Beams.htm But this is for a fixed-free cantilever beam. And 2...

Very late reply, but anyway: check out this post: https://www.physicsforums.com/showthread.php?t=159397&highlight=simulink

Now, where would the standard rubberband come into play in a Saturn V? Apart from it being a very, how to put it, complicated and dangerous way of transporting eggs.

I cannot think of any 'vehicle' that doesn't have rotating parts. !

Indeed, Excel is great for scientific data import and mathematical manipulations. I've used Mathcad, Mathematica, Origin and Excel (with VBA). It is easy to create VBA functions with excel because of the 'record-macro' function. Also, not everybody of my clients can read origin files, so...

The complex yet physical correct way to do it is by setting up a system of differential equations in which the boundaray conditions line up. The cantilever can be divided in three sections. from x0 to x1 to x3 to x4. The first sections is an ordinary differential equation for a cantilever...

It's an area in between classical engineering and micro-engineering based on IC processes. It is interesting for the field of MEMS which I am in. But indeed, at this point in time I do not think there is anything worthwile. Thanks for your response anyway.

A 'sort of' discussion forum can be found on http://news.gmane.org/gmane.science.microelectromechanical-systems but it is not very good, forum-wise, not content-wise, a lot of bright people come there. I would propose also posting here on this forum, the more you post, the more chance people...

No, normally SU8 is applied with spincoating, or DRIE is used to etch the wafer. Wafers are only 0.5 mm thick. My problem is one of bith large and small sizes. The large features are easily machinable, around 3 mm deep and 6 mm wide. They are however much to deep for any of the micromachining...

I am currently investigating ways to make a mold for hot-embossing. Normally this is done by for instance SU8 on a silicon wafer, or DRIE of a silicon wafer. But my design is deeper than a normal wafer, around 5 mm deep. Because the devices are actually fairly large (for microsystems) I...

The work is force times distance (when linear) or better, the integral of force to the distance it acted upon. Thickness of what, the metal plate of the magnet.

From the reference given in post #3 the following: 300C times 0.36x10^-3 is about 0.1, 0.1 over 3.6 is 0.03, 3% change. There is no talk of applying a current through the a-Si:H and seeing a change in refractive index. I also am not certain if a-Si:H is conductive or not.

I just understood that if the lattice parameter changes, the whole volume per atom has to change, and thus the layer expands. If it is related to the coefficient of expansion it is related to the stress induced by that. If that is the case than heating is indeed the best way to apply the...

Off course I cannot disagree on this that it is the lattice constant change that creates this refractive index change, I just think it's hard to believe. If it's just a thin layer of a-Si:H on a wafer that is getting thicker, this thin layer is jused in DBR and fabry-perot etalons in which...

I would like to know more about the thermo-optic effect. I've got the following down: The thermo-optic effect is the thermal modulation of the refractive index of a material. The refractive index of a material can be modulated as a function of its thermo-optic coefficient α. n(\DELTA T)=n_0 +...