Development of computer chips cooling

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Discussion Overview

The discussion revolves around the cooling of computer chips, specifically focusing on methods to achieve lower temperatures under load. Participants explore various cooling techniques and the implications of these methods on chip performance and safety.

Discussion Character

  • Exploratory, Technical explanation, Debate/contested

Main Points Raised

  • One participant suggests that achieving temperatures close to freezing for processor chips is desirable and proposes methods such as blowing cold air or using cold liquid directly on the chip.
  • Another participant questions the ambiguity of the original post regarding the specific type of chips being discussed, confirming that the focus is on computer processor chips.
  • A participant advises caution, recommending adherence to manufacturer guidelines for cooling high-power chips, noting that artificially lowering heat sink temperatures may not effectively reduce internal temperatures due to thermal interfaces.
  • One participant expresses a preference for using a liquid or gaseous thermal interface to enhance cooling efficiency, suggesting that isobutane in the cooling tubes could improve radiator performance.

Areas of Agreement / Disagreement

Participants do not reach a consensus; there are multiple competing views on the best cooling methods and the implications of those methods on chip performance and safety.

Contextual Notes

Some limitations include assumptions about the effectiveness of proposed cooling methods, the dependence on specific chip designs, and the potential risks associated with unconventional cooling techniques.

mitro
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TL;DR
Striving for the minimum temperature under processor load
I think 50-70 degrees under load is a lot, and need to reach the opposite point close to processor cold freezing.
Can blow on the processor chip or leak сcold liquid on it, by removing the lid and radiator?

And add isobutane to the tubes of the processor cooler and pump it, or replace the liquid with gas in watercooling?
 
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Can we assume you are talking about computer processor chips? OP is a bit ambiguous on the relevant industry.
 
DaveC426913 said:
Can we assume you are talking about computer processor chips? OP is a bit ambiguous on the relevant industry.
Yes.
 
IMO it's wise to follow the manufacturer's advice when cooling high power chips. 'Artificially' keeping the heat sink temperature low will not always reduce the dissipation the semicolnuctor. There are internal thermal interfaces, on the way out to the heat sink and the temperature inside may be higher than you think. You just can't say what's going on inside the package. The manufacturers could afford to take chips to destruction when testing but maybe you can't.
 
I would prefer a liquid or gaseous thermal interface, then the cooling efficiency would depend on the temperature and flow rate.
I think the isobutane being rotated by the pump in the tubes will partially correct the radiator cooling.
 

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