Development of computer chips cooling

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SUMMARY

The discussion centers on advanced cooling techniques for computer processor chips, emphasizing the need to maintain temperatures significantly below 70 degrees Celsius under load. Participants suggest unconventional methods such as blowing cold air directly onto the chip, using isobutane in cooling tubes, and considering liquid-to-gas phase changes in water cooling systems. The consensus highlights the importance of adhering to manufacturer guidelines, as internal thermal dynamics can complicate cooling efficiency. Effective cooling strategies must account for both temperature and flow rate to optimize performance.

PREREQUISITES
  • Understanding of thermal dynamics in semiconductor devices
  • Familiarity with liquid cooling systems and their components
  • Knowledge of phase change materials and their applications in cooling
  • Experience with processor thermal management guidelines
NEXT STEPS
  • Research the use of isobutane in cooling systems for enhanced thermal conductivity
  • Explore liquid-to-gas phase change cooling techniques for processors
  • Study the impact of internal thermal interfaces on cooling efficiency
  • Investigate advanced thermal interface materials (TIMs) for improved heat dissipation
USEFUL FOR

This discussion is beneficial for hardware engineers, thermal management specialists, and enthusiasts looking to optimize cooling solutions for high-performance computer processors.

mitro
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TL;DR
Striving for the minimum temperature under processor load
I think 50-70 degrees under load is a lot, and need to reach the opposite point close to processor cold freezing.
Can blow on the processor chip or leak сcold liquid on it, by removing the lid and radiator?

And add isobutane to the tubes of the processor cooler and pump it, or replace the liquid with gas in watercooling?
 
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Can we assume you are talking about computer processor chips? OP is a bit ambiguous on the relevant industry.
 
DaveC426913 said:
Can we assume you are talking about computer processor chips? OP is a bit ambiguous on the relevant industry.
Yes.
 
IMO it's wise to follow the manufacturer's advice when cooling high power chips. 'Artificially' keeping the heat sink temperature low will not always reduce the dissipation the semicolnuctor. There are internal thermal interfaces, on the way out to the heat sink and the temperature inside may be higher than you think. You just can't say what's going on inside the package. The manufacturers could afford to take chips to destruction when testing but maybe you can't.
 
I would prefer a liquid or gaseous thermal interface, then the cooling efficiency would depend on the temperature and flow rate.
I think the isobutane being rotated by the pump in the tubes will partially correct the radiator cooling.
 

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