Need a glue that will withstand 250°C or 350°C

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Discussion Overview

The discussion revolves around finding a suitable adhesive that can withstand high temperatures of 250°C or 350°C, while also being removable and not interfering with soldering processes. Participants explore various materials and their properties in the context of reflow soldering, focusing on both theoretical and practical aspects.

Discussion Character

  • Exploratory
  • Technical explanation
  • Debate/contested
  • Experimental/applied

Main Points Raised

  • One participant suggests gypsum (plaster) as a potential adhesive but expresses concerns about its stickiness, crumbliness, and solubility in acid.
  • Another participant inquires about the surface to which the wires will be attached, indicating that surface characteristics may influence adhesive choice.
  • A participant clarifies that the surface is not a major concern, mentioning that the insulation materials involved are sapphire and Kapton, with gold contacts.
  • One participant challenges the idea of using plaster, stating it is not acid soluble.
  • Another participant proposes high-temperature silicone or PDMS as alternatives, mentioning specific products that could aid in removal and suggesting preliminary testing on non-critical surfaces.
  • A later reply notes that while high-temperature silicone sounds promising, it may not withstand temperatures above 260°C, indicating a need for adjustments in application.

Areas of Agreement / Disagreement

Participants have not reached a consensus on the best adhesive. Multiple competing views and suggestions remain, with some uncertainty about the temperature limits of proposed materials.

Contextual Notes

Limitations include the potential breakdown of materials at high temperatures, the need for further testing of adhesives, and the specific requirements for adhesion and removability in the soldering context.

Who May Find This Useful

This discussion may be useful for individuals involved in electronics assembly, particularly those looking for high-temperature adhesives that are also removable, as well as those interested in material properties in soldering applications.

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To fixate some tiny wires for reflow soldering I need a glue that will withstand 250°C or 350°C and can be removed later. It should also not "sweat" or dissolve in tin so the solder stays clean.

I have thought about gypsum (plaster) and I hope it's removable with acid. But I fear it will get crumbly, isn't sticky enough and not nice to use.

Do you have any suggestions? I am sure there must be something water based. If salt would only be more sticky, and sugar wouldn't burn...

Being common in chemistry labs would be a plus, but not a prerequisite.
 
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What sort of surface are you trying to stick the wires to?
 


The surface matters little to me since it is just supposed to support the structure while soldering. The insulation materials involved are sapphire and capton, the contacts are gold.
 


I would not call plaster acid soluble.

--
 


High-temperature silicone or PDMS (poly dimethoxysilane--silicone for micro/nanofabrication types)? Especially if you let it mould around whatever it is you're trying to hold in place.

To dissolve it, there are a few products on the market that might work that you can find in your local hardware store (DAP Silicone-Be-Gone can be found at Home Depot and Rona if you're in Canada) which I've never used. But for PDMS, there's a product called Dynasolve that works wonders for some friends / colleagues of mine.

There's a product from MG Chemicals that's meant for stripping various conformal coat / potting / encapsulation chemicals (of various compositions):
http://www.mgchemicals.com/products/8310.html

Either way, I'd advise you to test it out on, say, a glass slide or something before doing it for real (the application of the adhesive, temperature treatment, and then subsequent attempt at strip).
 
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That sounds promising. The temperature is still a little low. It seems anything breaks down at 260°C the latest, but I can probably tweak a bit with the flux.
 

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