Volatile vs Non-Volatile Etch Products: Understanding the Difference

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SUMMARY

This discussion clarifies the distinction between volatile and non-volatile etch products in semiconductor IC production, specifically focusing on sputtering and Reactive Ion Etching (RIE). Sputter etching generates non-volatile products as ions knock off surface atoms, while RIE produces volatile etch products by enhancing surface reactivity through ion bombardment. The conversation emphasizes the importance of understanding these differences for effective semiconductor manufacturing processes.

PREREQUISITES
  • Understanding of semiconductor IC production processes
  • Familiarity with sputtering techniques
  • Knowledge of Reactive Ion Etching (RIE)
  • Basic concepts of ion bombardment and surface chemistry
NEXT STEPS
  • Research the principles of sputter etching in semiconductor fabrication
  • Learn about the mechanisms of Reactive Ion Etching (RIE)
  • Explore the impact of volatile vs non-volatile etch products on semiconductor performance
  • Investigate advanced etching techniques and their applications in IC production
USEFUL FOR

Semiconductor engineers, process technicians, and researchers involved in IC fabrication and etching processes will benefit from this discussion.

readaynrand
What does it mean that an etch product (for example from sputtering or chemical etching) is volatile / non volatile?
 
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readaynrand said:
What does it mean that an etch product (for example from sputtering or chemical etching) is volatile / non volatile?

Do you mean as in semiconductor IC production? Or some other kind of production? Could you please be more specific, and give some examples?
 
berkeman said:
Do you mean as in semiconductor IC production?

Exactly.

One example is sputter etching, where ions are accelerated to the surface to knock off surface atoms due to momentum transfer. My textbook says that these products are not volatile.

Another method is Reactive Ion Etching (RIE) where ions make a low reactive surface more reactive, e.g. due to damaging, to allow for the gas phases species to react and form etch products that are volatile, according to my textbook.
 

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