Galvanic Cell Changes: Copper Deposition on X

In summary, during the electrolysis, 1.05 g of copper is deposited on electrode X, resulting in a transfer of 0.0333 mol of electrons and a loss of 3.60 g of silver on electrode W. The statement C, that Z is a salt bridge, may also be correct.
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Homework Statement


During electrolysis in the cell below, 1.05 g copper is deposited on electrode X. Which one of the following statements is correct?

(Relative atomic masses Cu = 63, Ag = 108).
Screen Shot 2016-07-01 at 3.36.05 PM.png

  1. A) The mass of silver electrode W decreases by 3.60 g.
  2. B) The mass of silver deposited on electrode Y during the electrolysis is 1.80 g.
  3. C) Z is a salt-bridge.
  4. D) The concentration of copper ions in solution decreases during the electrolysis.
  5. E) The flow of negative charge is from right to left in Z.

Homework Equations

The Attempt at a Solution



I chose A. Since 1.05g of Cu is deposited, there are 0.01667 mol of Cu deposited. This means there are 0.0333 mol of electrons transferred. Which means there are 0.0333 mol of Ag lost in the anode. This means the anode lost 3.60g of Ag. However, C also makes sense as Z is the salt bridge. Could someone tell me where I went wrong?
 
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  • #2
Z is a wire.
 
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Thanks!
 

1. How does a galvanic cell work?

A galvanic cell is an electrochemical cell that converts chemical energy into electrical energy. It consists of two half-cells, each containing an electrode and an electrolyte solution. The two half-cells are connected by a conductive material, allowing for the transfer of electrons. The chemical reactions that occur at the electrodes generate a flow of electrons, creating an electrical current.

2. What is the purpose of copper deposition on X in a galvanic cell?

Copper deposition on X is a process that occurs in the half-cell containing the copper electrode. As the copper electrode is oxidized, copper ions are released into the electrolyte solution. These ions then travel to the other half-cell, where they are reduced and deposited onto X. This process helps to maintain a balance of charge in the galvanic cell and allows for the continuous flow of electrons.

3. How does the concentration of the electrolyte solution affect copper deposition on X?

The concentration of the electrolyte solution can affect the rate of copper deposition on X. A higher concentration of electrolyte can increase the rate of the chemical reaction, leading to a faster deposition of copper. However, if the concentration is too high, it can also create a buildup of ions on X, which can hinder the reaction and decrease the rate of deposition.

4. Can the type of electrolyte solution used affect copper deposition on X?

Yes, the type of electrolyte solution can affect the rate of copper deposition on X. Different electrolytes have different properties that can influence the rate of the chemical reaction. For example, a more acidic electrolyte may increase the rate of deposition, while a more basic electrolyte may slow it down. It is important to choose an appropriate electrolyte for the desired rate of copper deposition.

5. How do external factors, such as temperature, impact copper deposition on X?

External factors, such as temperature, can affect the rate of copper deposition on X. In general, an increase in temperature can increase the rate of the chemical reaction, leading to a faster deposition of copper. However, if the temperature is too high, it can also cause changes in the properties of the electrolyte or the electrodes, which may have a negative impact on the reaction. It is important to carefully control and monitor the temperature in a galvanic cell to ensure optimal performance.

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