Discussion Overview
The discussion revolves around finding an appropriate adhesive to bond a 30 micrometer kapton foil to a copper metal surface, specifically for use in a cryostat environment at temperatures ranging from 4.2 K to room temperature. The bonding must be strong enough to withstand high vacuum conditions and liquid helium flow, with curing limited to room temperature.
Discussion Character
- Technical explanation
- Experimental/applied
- Debate/contested
Main Points Raised
- One participant inquires about suitable adhesives for bonding kapton foil to copper, emphasizing the need for strength at low temperatures and high vacuum conditions.
- Another participant suggests that most glues would work down to 4.2 K, noting that concerns typically arise from out-gassing or thermal conductivity, which may not be critical in this case.
- A specific adhesive, Eccobond, is recommended by one participant for its thermal conductivity, alongside a mention of Stycast, although it is described as messier to use.
- A participant clarifies their application, describing a hollow copper rod with holes for X-ray passage, and reiterates the need for strong bonding under specified conditions.
- Questions arise regarding the force required for bonding, with calculations presented to determine if a weight of 155 grams is sufficient to meet the adhesive's manual requirements.
- Another participant confirms the calculations regarding the necessary weight to apply force for bonding.
Areas of Agreement / Disagreement
Participants express varying opinions on the types of adhesives suitable for the application, with no consensus reached on a single best option. There is also a discussion on the bonding force required, with some calculations confirmed but no definitive agreement on the implications for the adhesive's effectiveness.
Contextual Notes
Participants mention specific conditions such as the need for room temperature curing and the absence of concerns regarding thermal or electrical conductivity, which may limit the applicability of certain adhesives.