How does photolithography align wafers through opaque layers?

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SUMMARY

Photolithography, also known as optical lithography or UV lithography, is essential in microfabrication for aligning wafers through opaque layers. The process utilizes alignment mark regions that are transparent, allowing optical techniques such as lasers to align the wafer accurately. A hard mask is employed, but it must contain clear areas for effective alignment. In modern CMOS fabrication, a wafer may undergo the photolithographic cycle up to 50 times to achieve precise patterns.

PREREQUISITES
  • Understanding of photolithography techniques
  • Familiarity with optical alignment methods
  • Knowledge of CMOS fabrication processes
  • Experience with photoresist materials and applications
NEXT STEPS
  • Research the design and implementation of alignment mark regions in photomasks
  • Explore advanced optical alignment techniques using lasers in lithography
  • Study the chemical treatments involved in photoresist processing
  • Investigate the impact of multiple photolithographic cycles on CMOS wafer fabrication
USEFUL FOR

This discussion is beneficial for microfabrication engineers, photolithography specialists, and anyone involved in semiconductor manufacturing processes.

Edge5
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In a lithography process I have a hard mask which is opaque. I have to make a wafer alignment, however I use optical techniques to align my wafer (lasers etc.) . How can I align my wafer through an opaque layer?
 
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Edge5 said:
In a lithography process I have a hard mask which is opaque. I have to make a wafer alignment, however I use optical techniques to align my wafer (lasers etc.) . How can I align my wafer through an opaque layer?

The mask must not be opaque everywhere, otherwise what is the point? Aren't there clear areas that you can see through? Typically one includes alignment mark regions that are clear through which you can see the underlying wafer.
 
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https://en.wikipedia.org/wiki/Photolithography said:
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate. A series of chemical treatments then either engraves the exposure pattern into the material or enables deposition of a new material in the desired pattern upon the material underneath the photo resist. For example, in complex integrated circuits, a modern CMOS wafer will go through the photolithographic cycle up to 50 times.
 

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