Hope we have some PVD specialists in the house :) we have a pfeiffer e-beam PVD in the lab which i use to deposit Ni and Pt thin films ( around 100nm each) on Si wafers. I have always had the problem of "Ni splashes" while heating the target ( with the e beam) which leads to a process stop ( maybe some of it reaches the filament ( source for electrons) beneath the target creating a short contact?. This means i need to restart the process using the software to deposit the remaining layer ( eg process stops at 70 nm i need to restart the process to deposit the 30 nm remainder layer) https://en.wikipedia.org/wiki/Electron_beam_physical_vapor_deposition#/media/File:Electron_Beam_Deposition_001.jpg How can i reduce such splashes during sputtering? what parameters can be controlled to achieve sputtering without process stop ? Thank you ! and greets from DE.