Copper Plating Mystery: Solve the Puzzle!

[Flyingwing12]

I had a solution of copper sulfate in (vinegar) and noticed that when I wire brushed certain metals, the copper made a beautiful arrangement on the work piece, often a perfect semi-gloss. The copper is also seemingly bonded to the metal ( can't wipe it off).

However, when I use conventional electroplating with the solution, the copper just barely hangs on the surface of the work. And with " dirty " copper as the anode, the result is very poor.

So why does this happen? I thought it was the wire wheel depositing a huge positive charge on the work ( which is a pair of pliers with insulated handles. ;) ).

Very interesting indeed.

 

[Simon Bridge]

Wire brushing also dramatically changes the surface characteristics doesn't it?
Though, to me, your photo just looks rusty.

 

[NascentOxygen]

Interesting. This might be better placed in the Chemistry subforum, being quite appropriate for industrial chemists.

 

[MATLABdude]

I don't have a whole lot of experience with electroplating, but as Simon alludes to, electroplating is highly sensitive to surface preparation. When you wire brush, you're probably removing surface oxide along with any protective coating. Applying a degreaser (and scrubbing) also goes a long way towards removing oils, grease, and grime (which also 'mask' the surface, preventing deposition).

Still, if you hit the "Report" button, you can summon a moderator and get them to move your post over to Chemistry.

 

[alphysicist]

After reading your description of the copper plating mystery, it seems that the wire brushing process is creating a stronger bond between the copper and the metal surface compared to conventional electroplating. This could be due to the mechanical action of the wire brush, which may clean and roughen the surface, providing more surface area for the copper to adhere to. It is also possible that the wire brush is creating a more positive charge on the metal, allowing for better bonding with the copper ions in the solution.

Another factor to consider is the composition of the metal being plated. Some metals may have a natural affinity for copper, making it easier for the copper to bond and form a strong arrangement. Additionally, the use of "dirty" copper as the anode may also affect the plating process as it can introduce impurities into the solution.

Further experimentation and analysis would be needed to fully understand the mechanisms at play in this copper plating mystery. It is always exciting to discover new and unexpected results in scientific experiments, and your findings may open up new possibilities for improved plating techniques in the future.