Measuring Temperature of PCB Via

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Discussion Overview

The discussion focuses on methods for measuring the temperature of a PCB via, particularly given the small size of the via (0.5 mm). Participants explore various techniques, including thermocouples and thermal imaging, while considering the challenges associated with accurate temperature measurement in such confined spaces.

Discussion Character

  • Exploratory
  • Technical explanation
  • Debate/contested

Main Points Raised

  • One participant expresses uncertainty about using a thermocouple due to the difficulty of adhering it to the via wall and the potential for heat loss affecting readings.
  • Another participant suggests using a thermal camera, specifically the FLIR ONE IR camera adapter, but notes limitations in measuring absolute temperatures and the need for the object to be larger than the camera's spot size.
  • Concerns are raised about the impact of signal current on heating within the via, with one participant indicating that they are measuring temperature on a power plane and considering how various parameters might affect results.
  • A suggestion is made to use fine wire thermocouples, with a historical reference to a technique involving welding the thermocouple wires to a surface, although doubts about connecting to copper are mentioned.
  • One participant proposes measuring the voltage drop across the via while monitoring the circuit current, suggesting that this could provide a proportional relationship to temperature changes.
  • Thermal indicating paints are mentioned as a potential method, though one participant expresses skepticism about their practicality.

Areas of Agreement / Disagreement

Participants do not reach a consensus on the best method for measuring the temperature of the PCB via. Multiple competing views and techniques are presented, with ongoing uncertainty about their effectiveness.

Contextual Notes

Limitations include the small size of the via affecting measurement accuracy, the potential for heat loss when using thermocouples, and the challenges of thermal imaging due to the required distance and spot size. Participants also note that general rules of thumb for heat transfer may not apply under specific conditions.

Who May Find This Useful

This discussion may be of interest to engineers and researchers working with PCB design, thermal management, or temperature measurement techniques in small-scale applications.

  • #31
berkeman said:
With the wonders of Internet cookies and Amazon and Facebook, an advertisement for this just showed up in my Facebook feed...
They are so nice with you. Guess what started to come up regularly (without any previous search) when I passed forty :doh:

Averagesupernova said:
Yeah I've noticed that industrial is always more neatly done.
It's not about industry. Any tech who thinks he will have a second time with that panel will do it like this.
Well, it's a bit contradictory since because they do it like this it's unlikely to have a second time within a decade or so...:wink:
 
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