SUMMARY
This discussion focuses on measuring the temperature of small vias on printed circuit boards (PCBs), specifically a 0.5 mm via. Participants suggest using a FLIR ONE IR camera adapter for thermal imaging, although its effectiveness is limited by the size of the via compared to the camera's spot size. Alternatives include using low-mass thermocouples, particularly those from Omega with a diameter of 0.003 inches, and capturing contact transients with an oscilloscope to determine temperature at the moment of contact. The conversation emphasizes the challenges of accurately measuring temperature due to heat dissipation and the need for careful attachment methods for thermocouples.
PREREQUISITES
- Understanding of thermal imaging techniques and limitations
- Familiarity with thermocouples, specifically low-mass types
- Knowledge of PCB design and via characteristics
- Experience with data acquisition systems for temperature measurement
NEXT STEPS
- Research the specifications and capabilities of the FLIR ONE IR camera adapter
- Explore the use of low-mass thermocouples for precise temperature measurements
- Investigate methods for capturing contact transients with an oscilloscope
- Study the relationship between via resistance and temperature changes under varying current levels
USEFUL FOR
Engineers, PCB designers, and thermal management specialists interested in accurately measuring temperatures in small vias and optimizing PCB performance under varying electrical loads.
