Tin Whisker (TW) growth in electronics is a significant concern, particularly with pure tin plating. Current data on TW mitigation is sparse, with much of the available information being over a decade old, as noted by Ray in his presentation preparation. The use of alloys such as Sn96Ag3Cu0.7 has proven effective in suppressing TW growth, with evaluations showing no whiskers in soldered joints after 10-15 years of service. However, caution is advised with cheap connectors that may be plated with pure tin, as they pose a higher risk for TW formation.
PREREQUISITESElectronics engineers, materials scientists, and quality assurance professionals involved in soldering and component selection for electronic devices will benefit from this discussion.
A.f.a.i.k., additional metals in Sn96Ag3Cu0.7 (my third preferred solder after Sn-Pb and Sn-Bi) or similar alloys are suppressing tin whiskers good enough. I have evaluated many parts soldered with it after 10-15 years of service and never seen a whisker in soldered joints. Cheap connectors which are sometimes plated with pure tin are a problem though - learned to avoid them.rray said:Summary: I am preparing a presentation on TW and have reviewed the NASA site which is good, but most of the data is at least 10 years old.
I am preparing a presentation on TW and have reviewed the NASA site which is good, but most of the data is at least 10 years old. Does anyone have any current data on TW mitigation?
Here is the NASA link I used ►► https://nepp.nasa.gov/whisker/
Thanks, Ray