Two definitions of material dissipation factor

AI Thread Summary
The discussion centers on the definitions of the material dissipation factor (Df) and dielectric constant (Dk). The first definition describes Dk as the relative permittivity and Df as the ratio of energy lost to energy stored. The second definition, referenced from a webinar, inaccurately equates the imaginary component of complex permittivity with Df. The consensus is that the first definition is correct, while the second is considered a poor formulation. Clarity in these definitions is essential for accurate understanding in materials science.
senmeis
Messages
72
Reaction score
2
TL;DR Summary
material dissipation factor
Hi,

I have seen two versions of definitions of material dissipation factor Df:

The first one:
Dk (dielectric constant) = K = relative permittivity = ɛ -jɛ’ , ɛ = energy stored and ɛ’ = energy lost.
Df (dissipation factor/loss tangent) = ratio of ɛ’ and ɛ

The second one:
On slide 8 of webinar http://www.globalcommhost.com/roger...17_JC_microstrip_coplanar_stripline_final.pdf:
The imaginary component of complex permittivity is Df (dissipation factor).

Which one is correct?
 
Engineering news on Phys.org
The first definition is correct. Regarding the second one, I think it's just a sloppy formulation.
 
Hello! I've been brainstorming on how to prevent a lot of ferrofluid droplets that are in the same container. This is for an art idea that I have (I absolutely love it when science and art come together) where I want it to look like a murmuration of starlings. Here's a link of what they look like: How could I make this happen? The only way I can think of to achieve the desired effect is to have varying droplet sizes of ferrofluid suspended in a clear viscous liquid. Im hoping for the...
Hello everyone! I am curious to learn how laboratories handle in-house chip manufacturing using soft lithography for microfluidics research. In the lab where I worked, only the mask for lithography was made by an external company, whereas the mold and chip fabrication were carried out by us. The process of making PDMS chips required around 30 min–1 h of manual work between prepolymer casting, punching/cutting, and plasma bonding. However, the total time required to make them was around 4...
Back
Top