The term "standard" in SCCM (standard cubic centimeters per minute) refers to specific standard conditions, typically defined as 68°F and 14.7 psia in the US, while European standards may use 0°C. The conversion from SCCM to cubic meters involves the calculation that 1 cubic centimeter equals 1/1,000,000 cubic meters. In practical applications, such as the deposition of AlN in a vacuum chamber with a nitrogen flow rate of 5 SCCM and a deposition rate of 1 angstrom/s, various factors including voltage, current, and chamber geometry must be considered for accurate film thickness estimation.
PREREQUISITESResearchers, engineers, and technicians involved in gas flow measurements, vacuum deposition processes, and material science applications will benefit from this discussion.
Ravian said:say Al is evaporated in a vacuum chamber to form a thin film of AlN, say flow rate of N2 is 5sccm and deposition rate is 1 angstrom/s. then in 10minutes how thick film of AlN is formed? does in this case we need to consider voltage and current values (used to evaporate Al) also in order to estimate film thickness?
Dr Lots-o'watts said:... and the shape of the plasma, and the shape and size of the chamber, and possibly many other things. Have fun.
Q_Goest said:The term "standard" refers to standard conditions, usually 68 F and 14.7 psia (in the US). You'll find however, that different industries take liberties in defining standard conditions. I believe there are European industries that define standard conditions as 0 C (not sure the pressure they use). You should ask whoever gave you the values to define standard conditions for you if you need something any more accurate than that.
Wikipedia said:The current version of IUPAC's standard is a temperature of 0 °C (273.15 K, 32 °F) and an absolute pressure of 100 kPa (14.504 psi, 0.986 atm)[1], while NIST's version is a temperature of 20 °C (293.15 K, 68 °F) and an absolute pressure of 101.325 kPa (14.696 psi, 1 atm).