Discussion Overview
The discussion revolves around the adhesion properties between aluminum (Al) and gold (Au), particularly in the context of depositing Au on an Al layer. Participants explore the challenges associated with this process, including intermetallic formation and potential solutions to improve adhesion.
Discussion Character
- Exploratory, Technical explanation, Debate/contested
Main Points Raised
- One participant questions the adhesion quality between Al and Au when depositing Au on an Al layer.
- Another participant notes that the adhesion is poor and mentions the issue of intermetallic formation, specifically referencing "purple plague" as a potential problem.
- A suggestion is made to deposit a titanium (Ti) or titanium/tungsten (Ti/W) layer between Al and Au to enhance adhesion and mitigate intermetallic issues.
- A participant inquires about the thickness of the Ti layer, proposing 20nm as a possible option.
- Another participant agrees that a Ti layer is advisable and suggests that 20nm should be sufficient.
Areas of Agreement / Disagreement
Participants generally agree on the necessity of a Ti layer to improve adhesion, but there is no consensus on the optimal thickness or the extent of the adhesion issues.
Contextual Notes
The discussion does not clarify the specific conditions under which the adhesion properties were evaluated, nor does it address the potential variability in results based on different deposition techniques or environmental factors.