Can electroplating Cu on gold improve adhesion?

[Si14]

Hi all:

I have a 200nm Au seed layer. and I am electroplating Cu on that using a solution. but the result is not good. The adhesion between the electroplated copper and gold seed layer is very poor and it easily peels off.
1-I wonder how can I increase the adhesion between them?

2-Does depositing (e-beam evaporation) a layer of Cu on top of the Au seed layer before plating help?

Thank you very much.

 

[MLSmateo]

I am surprised that you are having an adhesion problem.

http://www.springerlink.com/content/q1346p3730605716/"

What precursors are you using? What's the pH?

 

[Si14]

Thank you MLSmateo.
Actually, I found the problem. The Cu-plating quality on Au is good. I made a mistake.
Yes, I have read somewhere that this process is verified, but the reverse process (EP Au on Cu) is very hard to realize.
Thanks again anyways.