The discussion centers on methods for depositing a layer of indium with a thickness of 10-100 microns on a metal bar, specifically for use as a thermal connector. The user has chosen electroplating as the preferred method, considering the indium sulfamate plating bath offered by Indium Corporation. Alternative methods discussed include soldering and electron beam evaporation, with the latter noted for its ease due to indium's low melting point. The conversation highlights the need for reference tables and formulas to achieve the desired thickness accurately.
PREREQUISITESEngineers, materials scientists, and prototyping specialists involved in thermal management solutions and those looking to optimize indium deposition techniques.