SUMMARY
Silicon On Insulator (SOI) technology utilizes a three-layer structure consisting of a handle layer, a buried oxide layer (SiO2), and a device layer of silicon. This configuration enhances the control over the fabrication process, making it preferable for applications such as transistors and micromachines. SOI wafers are approximately three times more expensive than traditional silicon wafers, but they offer significant benefits in terms of performance and scalability. The discussion also touches on the implications of tunneling effects as device dimensions decrease.
PREREQUISITES
- Understanding of semiconductor physics
- Familiarity with silicon wafer fabrication processes
- Knowledge of oxide materials, specifically silicon dioxide (SiO2)
- Awareness of microelectromechanical systems (MEMS)
NEXT STEPS
- Research the properties and applications of silicon-on-insulator technology
- Explore the effects of tunneling in nanoscale devices
- Learn about the fabrication techniques for SOI wafers
- Investigate the cost-benefit analysis of SOI versus traditional silicon wafers
USEFUL FOR
Engineers, semiconductor researchers, and professionals involved in microelectronics and MEMS design will benefit from this discussion on Silicon On Insulator technology.