Resources on Electronic Packaging

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SUMMARY

This discussion focuses on resources for electronic packaging, specifically at the integrated circuit (IC) level. Key topics include thermal heat transfer and the importance of understanding thermal resistance ratings, such as Θjc (junction to case) and Θja (junction to air). Participants recommend exploring IC vendor websites, such as Motorola and ON Semiconductor, for information on available IC packages and their power dissipation capabilities. Additionally, a Wikipedia article on thermal resistance is suggested as a foundational resource.

PREREQUISITES
  • Understanding of integrated circuit (IC) packaging
  • Familiarity with thermal resistance concepts, including Θjc and Θja
  • Knowledge of power dissipation in electronic components
  • Basic research skills to navigate vendor websites
NEXT STEPS
  • Explore Motorola's and ON Semiconductor's websites for IC package specifications
  • Study thermal resistance and conductivity principles through the provided Wikipedia article
  • Investigate different types of IC packages and their thermal performance ratings
  • Learn about heat sink design and its impact on thermal management in IC packaging
USEFUL FOR

Students, engineers, and researchers involved in electronic packaging, particularly those focusing on integrated circuit design and thermal management strategies.

carlodelmundo
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Hi,

I will be volunteering my time helping my professor in the realm of "electronic packaging." There doesn't seem to be a lot of straightforward tutorials on electronic packaging, could anyone guide me with the proper resources so I can take a look?

Thanks

Carlo
 
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carlodelmundo said:
Hi,

I will be volunteering my time helping my professor in the realm of "electronic packaging." There doesn't seem to be a lot of straightforward tutorials on electronic packaging, could anyone guide me with the proper resources so I can take a look?

Thanks

Carlo

Can you say a bit more about it? Are you talking about packaging at the IC level, MCM level, module level, or product level?
 
If I recall correctly, I am going to be packaging in the IC level. The issue of thermal heat transfer (to properly release heat from the components) was also discussed. I am assuming this is part of a trial-and-error back-of-the-envelope calculation sort of thing? Or is there really a text suitable for such study?
 
carlodelmundo said:
If I recall correctly, I am going to be packaging in the IC level. The issue of thermal heat transfer (to properly release heat from the components) was also discussed. I am assuming this is part of a trial-and-error back-of-the-envelope calculation sort of thing? Or is there really a text suitable for such study?

There are a number of different types of IC packages, with varying amounts of power dissipation capability. I'd recommend starting at some IC vendor websites and looking at the IC packages that they have available, and the power levels that they are rated at.

Many packages and heat sinks have "Theta" ratings, that are basically their thermal resistances from the internal IC junctions to the package exterior or to ambient air. Look for ratings like \Theta_{jc} from junction to case and \Theta_{ja} from junction to air.

Check out websites like Motorola (they make a lot of power semiconductors), ON Semi, and whatever vendors that make ICs like the ones you are researching.


Wikipedia also has a basic intro article to thermal resistance / conductivity:

http://en.wikipedia.org/wiki/Thermal_resistance

.
 
Thank you berkeman!
 

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