Electronic packaging cost / price

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SUMMARY

The discussion centers on the costs associated with electronic packaging, specifically focusing on low-cost packages such as SOT23 and low I/O PLCC. Participants emphasize the importance of the number of pins in determining costs and mention that while omitting lead frames (BGA) can reduce expenses, it may lead to higher defect rates if manufacturing processes are not optimal. Additionally, resources for further research on electronic packaging costs were shared, highlighting the availability of studies and data online.

PREREQUISITES
  • Understanding of electronic packaging types, specifically SOT23 and low I/O PLCC.
  • Knowledge of manufacturing processes related to electronic components.
  • Familiarity with cost breakdowns in electronics, including BOM (Bill of Materials) considerations.
  • Basic research skills to navigate online resources for studies and data.
NEXT STEPS
  • Research recent studies on electronic packaging costs, focusing on SOT23 and low I/O PLCC.
  • Investigate the impact of pin count on electronic packaging pricing.
  • Explore the implications of lead frame omission in BGA packaging.
  • Examine case studies on defect rates in low-cost electronic manufacturing processes.
USEFUL FOR

Engineers, product designers, and procurement specialists involved in electronic component sourcing and packaging optimization will benefit from this discussion.

slibon
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Hello,

I am looking for recent info/studies on electronic packaging costs.
I focus on the extreme cheap type of packages (e.g. SOT23).
In general it nails it down to low I/O PLCC.
A study on components sold in this type of package form is interesting too.
Story on cheap LEDs interst me too.

Regards
 
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slibon said:
Hello,

I am looking for recent info/studies on electronic packaging costs.
I focus on the extreme cheap type of packages (e.g. SOT23).
In general it nails it down to low I/O PLCC.
A study on components sold in this type of package form is interesting too.
Story on cheap LEDs interst me too.

Regards

I googled your term, studies on electronic packaging costs, and got lots of good hits:

http://www.google.com/search?source...1US302&q=studies+on+eletronic+packaging+costs

Google is your friend. Welcome to the PF, BTW.
 
I don't know if anyone makes it open knowledge, but cost of silicon + IP aside, the number of pins dominates. Of course, you can get discounts by leaving out the lead frame (BGA), but if your process isn't gloriously perfect, the defect rate will erase the BOM cost advantage.
 

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