Unbiased Physical Vapor Deposition

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SUMMARY

The discussion centers on the functionality of an unbiased Physical Vapor Deposition (PVD) system built by a user, which includes an ion source, argon, target material, and a substrate cradle made from an insulator. Despite the lack of bias, the system effectively produces high-quality coatings on substrates. The sputtered atoms possess sufficient kinetic energy to bond with the substrate surface, aided by the chemical affinity between coating and substrate atoms. The ion beam's role in pre-sputtering enhances adhesion by removing impurities from the substrate surface.

PREREQUISITES
  • Understanding of Physical Vapor Deposition (PVD) techniques
  • Knowledge of ion beam sputtering processes
  • Familiarity with substrate materials and their properties
  • Basic principles of atomic bonding and surface chemistry
NEXT STEPS
  • Research the principles of unbiased Physical Vapor Deposition systems
  • Learn about ion beam sputtering and its applications in coating technology
  • Explore methods for enhancing substrate adhesion in PVD processes
  • Investigate the effects of substrate material properties on coating quality
USEFUL FOR

This discussion is beneficial for materials scientists, engineers involved in coating technologies, and researchers interested in optimizing PVD systems for improved adhesion and coating quality.

jf11235813
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I apologize if this seems ignorant, but I am at a loss and I need some assistance. I recently built a small vacuum PVD system (Ion source, argon, target material, substrate cradle, etc.) and was showing it to a colleague when it was noticed that my system was unbiased. It actually didn't occur to me to bias the system when I was building it, but my substrate cradle is made from an insulator so it is definitely unbiased. My question is, how is it that it works?? Because it definitely works; I get a good coating on every substrate I sputter. Any help?
 
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If you are doing ion beam sputtering deposition, i. e. by aiming the ion source at the target, then the sputtered atoms reaching the substrate from the target will have an average kinetic energy that is generally more than enough (several eV) to form a bond with substrate surface atoms, but not enough energy to remove a significant amount of substrate atoms. So the coating should be pretty well adhered to the substrate, especially if there is a chemical affinity between the coating atoms and the substrate atoms. If you are using the ion beam to presputter the substrate surface before deposition, removing physically and chemically adsorbed impurity atoms, the adhesion should also be considerably removed.

Larry Stelmack lstelmack@alum.mit.edu
 
The ion source is actually pointing away from the target. Would you mind if i sent you a simple diagram to better illustrate? I'm not sure if I can explain it well enough.
 

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