Why photomasks are laser etched but ICs arent

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SUMMARY

The discussion clarifies that photomasks are essential in the fabrication of integrated circuits (ICs) due to their efficiency in mass production. While laser lithography is utilized for prototyping and one-off designs, it is not suitable for high-precision applications required for modern ICs, which often necessitate e-beam lithography for small feature sizes. The economic implications of using masks versus direct laser etching are significant, as mass production with photomasks is considerably faster and more cost-effective than laser etching silicon wafers directly.

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  • Understanding of photolithography processes
  • Familiarity with integrated circuit (IC) fabrication techniques
  • Knowledge of e-beam lithography
  • Basic principles of laser lithography
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  • Research advancements in e-beam lithography for IC production
  • Explore the economic factors influencing photomask usage in semiconductor manufacturing
  • Investigate the limitations of laser lithography in high-precision applications
  • Learn about the latest developments in photolithography technology
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Engineers, semiconductor manufacturers, and researchers involved in integrated circuit design and fabrication will benefit from this discussion, particularly those focused on lithography techniques and production efficiency.

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When an IC photomask is being fabricated, a laser carefully dissolves specific portions of the photo resist to develop the precise pattern. But when we make ICs, we use a photomask to place over the silicon and shine coherent light over it at once.

Since most of the engineering problems arise from this photolithographic process using a photomask, why do we not just laser etch the silicon wafers themselves? Would it take too long?
 
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We DO use laser lithographers for making ICs; but only for prototyping and one-offs (they are becoming quite common in university labs).
However. using a mask is just much faster if you want to make many copies of something.

Also, lasers are only useful for fairly crude lithography (hundreds of nm); you can't use it to make masks for chips with small feature sizes; these are made using e-beam lithography. Hence, laser lithographers are often used to defined conctacts etc whereas you still need e-beam lithography for the actual device.
 
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Jd0g33 said:
Since most of the engineering problems arise from this photolithographic process using a photomask, why do we not just laser etch the silicon wafers themselves? Would it take too long?

I wouldn't say "most" of the engineering problems are due to photolithography, although it is a very challenging area of wafer production. f95toli is correct that any kind of direct writing of features on a wafer would be much, much, much more expensive than mass producing with a mask and photolithography. Like many things in the IC business, it is an economic decision as much as a feasibility decision.
 
f95toli said:
We DO use laser lithographers for making ICs; but only for prototyping and one-offs (they are becoming quite common in university labs).
However. using a mask is just much faster if you want to make many copies of something.

Also, lasers are only useful for fairly crude lithography (hundreds of nm); you can't use it to make masks for chips with small feature sizes; these are made using e-beam lithography. Hence, laser lithographers are often used to defined conctacts etc whereas you still need e-beam lithography for the actual device.

thanks mate :smile:

learn something new every day

Dave
 

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