Why Sputter instead of Electroplate?

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Sputtering is preferred over electroplating for coating metal surfaces like razor blades due to its ability to quickly and uniformly deposit materials on solid surfaces. Electroplating, while effective, has limitations such as slower deposition rates and geometric instability, which can lead to uneven growth on sharp edges. The process of electroplating requires careful management of voltage gradients to avoid issues like whisker growth on edges. Sputtering, however, tends to coat exposed areas more effectively, making it suitable for delicate applications. Overall, the choice between sputtering and electroplating depends on the specific requirements of the coating process.
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Why is coating a metal with another metal using Sputtering any advantage over Electroplating?
Not the smartest question, but why should metal deposits be put onto other metals (like razor blades) using Sputtering instead of electrodeposition or electroplating the coating onto the metal object to be coated?
 
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Sputtering can quickly coat any solid surface, with an element or an alloy.
Electroplating can slowly plate a conductive surface, with an element.
 
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symbolipoint said:
like razor blades
Properly machined thin edges are really sensitive to practically everything.
Knife nerds suggests to clean your knives immediately after cutting lemon (or any acidic food!), for example.
Submerging the edge into an electrolyte and running current through them - you guess :wink:
 
Rive said:
Submerging the edge into an electrolyte and running current through them - you guess
With electroplating, the current is DC, with the correct polarity required to plate metals from the electrolyte onto the edge.

The rate of deposition during electroplating is determined by the voltage gradient. A sharp edge or point will therefore grow rapidly, while a flat surface develops only a thin layer. That is a form of geometric instability, an edge will grow whiskers. The plated item will need to be polished after plating.

With sputtering, there is a tendency to coat the areas of a surface exposed to the plasma, while not so much material reaches the sharp edges or points that have areas approaching zero.
 
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"Sputtering can quickly coat any solid surface, with an element or an alloy.
Electroplating can slowly plate a conductive surface, with an element."
-Baluncore

Worth repeating.
 
Dullard said:
Worth repeating.
"A lie told often enough becomes the truth." Vladimir Lenin.

I knowingly lied. My two line answer was a gross generalisation.

Electrodeposition is also used to deposit alloys.
https://www.mdpi.com/2079-6412/5/2/195/htm
 
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