To deposit a layer of indium with a thickness of 10-100 microns on a metal bar, electroplating has been chosen as the preferred method. While soldering and flattening or using an electron beam evaporator were initial considerations, the focus has shifted to electroplating due to the desired thickness. Reference tables for calculating mixtures for achieving the target thickness on copper surfaces are sought, with suggestions to consult existing literature on indium electroplating. An alternative method mentioned is melting bulk indium onto the connector using an indium flux, though achieving precise thickness may be challenging. The application for this indium layer is as a thermal connector.