SUMMARY
The discussion centers on the challenges of wire bonding low ductility materials such as Chromel, Manganin, and Konstantan. Key factors for successful bonding include the selection of appropriate pad materials, specifically gold or aluminum, and the use of specific bonding techniques like thermosonic bonding. The importance of using the correct wedge shape and maintaining a uniform intermetallic formation for bond strength is emphasized. Additionally, the use of carbon probes for bonding high nickel wires is suggested as a viable method.
PREREQUISITES
- Understanding of wire bonding techniques, specifically thermosonic bonding.
- Familiarity with materials such as gold, aluminum, Chromel, Manganin, and Konstantan.
- Knowledge of bonding equipment, including manual bonders and carbon probes.
- Awareness of intermetallic formation and its impact on bond strength.
NEXT STEPS
- Research thermosonic bonding techniques for aluminum and gold wire.
- Explore the properties and bonding challenges of low ductility materials like Manganin and Konstantan.
- Investigate the use of carbon probes in wire bonding applications.
- Study intermetallic formation processes and their effects on bond integrity.
USEFUL FOR
Engineers and technicians involved in microelectronics, materials science researchers, and professionals working with wire bonding in semiconductor applications.