1. The problem statement, all variables and given/known data A silicon chip measuring 5mm by 6mm and of thickness 1mm is embedded in a ceramic substrate. At a steady state, the chip has an electrical power input of 0.3W. The top surface of the chip is exposed to a coolant whose temperature is 20°C. The heat transfer coefficient for convection between the chip and the coolant is 150W/(m^2.k). If the heat transfer by conduction between the chip and the substrate is negligible, determine the surface temperature of the chip 2. Relevant equations 3. The attempt at a solution my attempt at this question is using the formula: Q= h(c)A (ΔT) where h(c) is the heat transfer coefficient I am unsure what to do with the electrical power that has been put in the question?