Question re. electroplated gold. Thank you

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SUMMARY

The forum discussion centers on the challenges of electroplating gold onto a silicon wafer with a gold seed layer using SU-8 photoresist. The user reported that the electroplated gold appeared black and granular, with an effective current set at 1.9 mA for a desired thickness of 50 µm over an area of 19 mm². Recommendations included reducing the current density, as 100 A/m² may be excessive, and ensuring the electrolyte used is capable of slightly dissolving gold to mitigate defects in the growing layer.

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This discussion is beneficial for materials scientists, electroplating technicians, and anyone involved in semiconductor fabrication or surface coating processes.

lodgezhao
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Hello, I have a question for electrodeposition of gold.

So I tried to electroplate gold on a Si wafer with gold seed layer on it. I used SU-8 as my photoresist to form a pattern. But my electroplated gold was black and granular.

Area is 19mm^2 and desired thickness is 50 um. I set the effective current to be 1.9 mA.

Any ideas?

Thank you so much!
 
Physics news on Phys.org
1. Try to reduce current, 100A/m^2 may be too much for electroplating.
2. What kind of electrolite do you use? Normally, it should slightly dissolve gold to remove defects of growing layer.
 

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