Hello everyone. My task is to select a thin film and deposition method that will achieve a few goals. The thin film will be sandwitched between a diamond and nickel alloy. The thin film needs to: Adhere to a diamond and nickel alloy strongly without inter diffusion. Stay together up temperatures of 700K, and be decently thermally conductive. The film can be deposited via standard methods like sputtering, Evaporation, JDC, CVD, ect... I know that diamond and nickel have similar bond structures (sp3) and a thin film with a similar structure would help maintain a strong bond. Any info would be greatly appreciated!