Which fan placement offers the most airflow for cooling electronics?

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SUMMARY

The discussion focuses on optimizing airflow for cooling electronics using two identical fans. The first arrangement is noted for overcoming more pressure, while the second arrangement is recognized for producing greater airflow. Key insights include the importance of high mass flow at critical locations and the impact of vent design on pressure differentials. Ultimately, relocating exhaust vents to higher positions in option B is determined to provide the most effective cooling solution.

PREREQUISITES
  • Understanding of fan performance characteristics, including pressure vs. flow curves.
  • Knowledge of airflow dynamics within enclosures.
  • Familiarity with vent design and its impact on airflow.
  • Basic principles of thermal management in electronics.
NEXT STEPS
  • Study fan performance metrics, specifically pressure vs. flow curves for different fan models.
  • Research airflow dynamics in electronic enclosures to optimize cooling strategies.
  • Explore advanced vent design techniques to enhance pressure differentials.
  • Investigate thermal management solutions for electronics, focusing on mass flow optimization.
USEFUL FOR

Electronics engineers, thermal management specialists, and anyone involved in designing cooling systems for electronic enclosures.

garyTheSnail
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TL;DR
Best fan position for airflow.
I have two identical fans to cool electronics within an enclosure. From the two drawings/options, which option offers the most airflow?
Thank you.
 

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russ_watters said:
The first arrangement can overcome more pressure, the second arrangement produces more airflow.
https://www.rotron.com/tech-corn/series-and-parallel
Yes, this. And you can have some control on the pressure differential with the design of your vents. Higher air velocity isn't going to help cooling too much, what you want is high mass flow (at the critical locations, of course). The answers lie in the pressure vs. flow curves for your fans combined with a rough model of the enclosure resistance, another pressure vs. flow curve.
 
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Relocating both exhaust vents to higher positions, option B offers the most cooling effect.
 
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Thank you all for the information.
 
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