Which fan placement offers the most airflow for cooling electronics?

AI Thread Summary
The discussion centers on optimizing airflow for cooling electronics using two identical fans. The first arrangement is noted for overcoming more pressure, while the second arrangement is recognized for producing greater airflow. Effective cooling depends on achieving high mass flow rather than just high air velocity, particularly at critical locations. The design of vent placement significantly influences pressure differentials and overall cooling effectiveness. Ultimately, relocating exhaust vents to higher positions in the second option is suggested to enhance cooling performance.
garyTheSnail
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Best fan position for airflow.
I have two identical fans to cool electronics within an enclosure. From the two drawings/options, which option offers the most airflow?
Thank you.
 

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russ_watters said:
The first arrangement can overcome more pressure, the second arrangement produces more airflow.
https://www.rotron.com/tech-corn/series-and-parallel
Yes, this. And you can have some control on the pressure differential with the design of your vents. Higher air velocity isn't going to help cooling too much, what you want is high mass flow (at the critical locations, of course). The answers lie in the pressure vs. flow curves for your fans combined with a rough model of the enclosure resistance, another pressure vs. flow curve.
 
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Relocating both exhaust vents to higher positions, option B offers the most cooling effect.
 
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Thank you all for the information.
 
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Due to the constant never ending supply of "cool stuff" happening in Aerospace these days I'm creating this thread to consolidate posts every time something new comes along. Please feel free to add random information if its relevant. So to start things off here is the SpaceX Dragon launch coming up shortly, I'll be following up afterwards to see how it all goes. :smile: https://blogs.nasa.gov/spacex/
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