Why do we need a doped substrate?

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SUMMARY

The discussion centers on the necessity of using a doped substrate in semiconductor manufacturing, specifically addressing the use of a P well instead of a p-doped substrate. A doped substrate is essential to ensure that isolation junctions remain reverse-biased, preventing unintended current flow. The process involves three key steps: removing substrate, adding to the substrate, and altering the substrate to achieve desired electrical properties. Understanding these processes is crucial for newcomers in the semiconductor field.

PREREQUISITES
  • Basic knowledge of semiconductor physics
  • Understanding of doping processes in semiconductors
  • Familiarity with silicon wafer fabrication techniques
  • Knowledge of electrical properties of materials
NEXT STEPS
  • Research "Silicon wafer doping techniques" for in-depth understanding
  • Learn about "Isolation junctions in semiconductor devices" to grasp their importance
  • Explore "PCB manufacturing processes" for parallels in fabrication techniques
  • Study "Electrical properties of doped semiconductors" to understand performance implications
USEFUL FOR

This discussion is beneficial for semiconductor engineers, materials scientists, and students pursuing studies in electrical engineering or physics, particularly those interested in semiconductor device fabrication and design.

uney
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From my textbook, I know why we use the P well instead of using the p-doped substrate directly, but why do we need a doped substrate?
I think this is a stupid question, and that's why I can't find out the ans from my testbook but considered that I am a new comer in semiconductor, please help me!
 
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It's used in order to assure that none of the isolation junctions will be forward biased.

This substrate is connected to the most negative potential to accomplish this.

Welcome to PF
 
For an overview of the details on the process consult here:

http://en.wikipedia.org/wiki/Semiconductors
http://en.wikipedia.org/wiki/Doping_(semiconductor)

I think the problem you are having is the processes used to create components on a die. In general there are three distinctly different processes: 1) Removing substrate 2) Adding to the substrate 3) Altering the substrate. Think of the substrate like a sculpture; the sculptor begins with a block larger than the finished work. The sculpture emerges as the excess material is removed. This is the same basic process as semiconductor production. Parts of a silicon wafer are removed, doped or added to in a specific order in such a way as to leave a particular finished design with specific electrical properties.

If you have ever seen the process of PCB mfg, it is in some ways similar. In this case you start with a copper clad board. Using one of various methods you place an acid resistant layer where you want the copper to remain, then you submerge the entire board in copper-dissolving acid. When the process is complete, only the areas with acid resistance remain. You then remove the acid resist and you have a PCB.

With a silicon wafer, you choose the initial doping to best facilitate the construction of the rest of the process. If 60% of the silicone in the final die is doped in a particular way, then you might begin by doping the entire wafer to that level. In the remaining processes you mask, etch and re-dope or deposit material as required for the stage.

I hope this gives you a crude idea of the process, and the "why" of the initial doping. There is a lot of information about the various doping processes, silicon wafers and die production available on the net; some of it is fascinating reading.

Fish
 
Thanks a lot
 

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