Discussion Overview
The discussion revolves around the phenomenon of material transfer in an arc between a copper cathode and a tungsten anode, specifically whether copper would be deposited on the anode and how to calculate the deposition rate. The scope includes theoretical considerations and practical applications related to cathodic arc deposition.
Discussion Character
- Exploratory, Technical explanation, Conceptual clarification
Main Points Raised
- One participant questions if striking an arc between a copper cathode and a tungsten anode would result in copper being deposited on the anode and seeks to understand the calculation of the deposition rate.
- Another participant references cathodic arc deposition as a relevant concept, suggesting it may provide insights into the question posed.
- A participant expresses interest in calculating the deposition rate and notes that it should be proportional to the current, while recommending consulting expert literature for specifics on different metals.
- Further resources are provided to assist in understanding the process and calculations involved.
Areas of Agreement / Disagreement
Participants do not reach a consensus on the specifics of the deposition process or the calculation methods, and multiple viewpoints regarding the deposition rate and its dependence on current are presented.
Contextual Notes
Limitations include the need for specific expert literature for accurate calculations and the potential variability in behavior depending on the materials involved.
Who May Find This Useful
This discussion may be useful for individuals interested in electroplating, cathodic arc deposition, and the behavior of materials in electrical arcs.