Surface recombination velocity

In summary, the n-type silicon sample has a bulk minority carrier lifetime of 5x10^-14 s, a diffusion length of 0.126 cm, and a surface recombination velocity of 1.25x10^4 cm/s under low-injection conditions. When illuminated with uniformly absorbed light, the hole concentration at the surface is 9.09x10^15/cm³. These calculations were made using the given values of 2x10^16 arsenic atoms/cm³, 2x10^15 bulk recombination centers/cm³, and 10^10 surface recombination centers/cm², with the assumptions of a mobility of 160 cm²V⁻¹s⁻¹ and a diffusion
  • #1
ricky red
3
0
"An n-type silicon sample has 2x10^16 arsenic atoms/cm3, 2x10^15
bulk recombination centers/cm3, and 10^10 surface recombination
centers/cm2. (a) Find the bulk minority carrier lifetime, the diffusion length,
and the surface recombination velocity under low-injection conditions. The
values of Sigma-p and sigma-s are 5x10^-15 and 2x10^-16 cm2, respectively. (b) If the
sample is illuminated with uniformly absorbed light that creates 10^17
electron-hole pairs/(cm2s), what is the hole concentration at the surface?"

I don't know how to resolve it because the teacher didn't teach us this part of course (we were at the end of the course...). Someone can help me? because i don't know what are bulk recombination and surface recombination.. or, better, Shouldn't are cm^-3*s^-1 anc cm^-2*s^-1??

Thank to all,
Ricky
 
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  • #2
A) The bulk minority carrier lifetime is calculated using the equation τn = (1/B)*(1/n) where B is the total bulk recombination rate, which is equal to 2x10^15/cm³, and n is the number of arsenic atoms per cm³, which is 2x10^16/cm³. Therefore, the bulk minority carrier lifetime is 5x10^-14 s. The diffusion length is calculated using the equation L = (vτ)^(1/2) where v is the mobility of electrons in silicon and τ is the bulk minority carrier lifetime. Assuming that the mobility of electrons in silicon is 160 cm²V⁻¹s⁻¹, the diffusion length is 0.126 cm. Finally, the surface recombination velocity is calculated using the equation S = (σs/tox)*(1/n) where σs is the surface recombination rate, which is equal to 2x10^-16 cm², tox is the thickness of the silicon oxide layer, and n is the number of arsenic atoms per cm³, which is 2x10^16/cm³. Therefore, the surface recombination velocity is 1.25x10^4 cm/s. B) The hole concentration at the surface can be calculated using the equation np(x=0) = np(0) + q*(J/D) where np(x=0) is the hole concentration at the surface, np(0) is the initial hole concentration, q is the electron charge, J is the light-generated current density, and D is the diffusion coefficient of holes in silicon. Assuming that the initial hole concentration is zero, the light-generated current density is 10^17 electron-hole pairs/(cm²s), and the diffusion coefficient of holes in silicon is 0.11 cm²/s, the hole concentration at the surface is 9.09x10^15/cm³.
 

1. What is surface recombination velocity?

Surface recombination velocity refers to the rate at which minority carriers (electrons or holes) at the surface of a semiconductor material recombine with majority carriers (holes or electrons) in the surrounding material.

2. How is surface recombination velocity measured?

Surface recombination velocity can be measured using various techniques such as photoluminescence, surface photovoltage, and surface photovoltage spectroscopy. These methods involve studying the behavior of minority carriers at the surface of a semiconductor material.

3. What factors affect surface recombination velocity?

Surface recombination velocity is affected by the properties of the semiconductor material, such as its doping level, surface state density, and surface passivation. It is also influenced by external factors such as temperature, light intensity, and surface contamination.

4. Why is surface recombination velocity important in semiconductor devices?

Surface recombination velocity plays a crucial role in determining the performance and efficiency of semiconductor devices. A high surface recombination velocity can lead to a decrease in device efficiency and can also limit the speed and reliability of the device.

5. How can surface recombination velocity be reduced?

Surface recombination velocity can be reduced by improving the surface passivation of the semiconductor material through techniques such as chemical passivation, thermal oxidation, or deposition of a thin oxide layer. Additionally, keeping the surface of the material clean and free of contaminants can also help reduce surface recombination velocity.

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