Can Previous Results Estimate Box Response When Plate Cools Faster?

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This discussion focuses on estimating the thermal response of a box mounted to a plate in a vacuum as the plate cools at different rates. The initial cooling rate is 3 C/min, and the subsequent rate is 4 C/min. The presence of a thermocouple on the box allows for measurement of its temperature response. Key considerations include the definitions of heat transfer mechanisms, particularly conduction and radiation, and the need for clear parameters such as dimensions and assumptions regarding heat flow direction.

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drewbagel423
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Let's say I have a box, mounted to a plate in a vacuum (pure conduction). The system is initially at a steady state at temperature Ti. The plate then begins cooling at a rate of 3 C/min. The box is going to cool at some rate, and with some time constant. For this test, I have place a thermocouple on the box, so I can measure its response.

Now I want to run it again such that the plate cools at a rate of 4 C/min. Is it possible to use the previous results to estimate the box's response for this new profile? If so, how could I go about doing it?

TIA
 
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vacuum does not necessarily mean conduction since there is also radiation. Your problem is rather ill defined. What are the dimensions, assumptions, why does the plate begins cooling?
I cannot make up from you description if heat is going from the plate to the box or vise-versa
 

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